• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a polishing pad (10) suitable for polishing or planarizing at least one of the semiconductor, optical and magnetic substrates. The polishing pad (10) has a polishing surface (16), an opening through the polishing pad, and a transparent window (20) in the opening in the polishing pad. The transparent window has a concave surface (32) whose depth increases with the use of the polishing pad. A signal region (38) is inclined toward the central region (36) to facilitate removal of debris and a debris evacuation groove (12A) extending through the central region into the polishing pad. Rotation of the polishing pad with polishing fluid in the debris discharge groove feeds debris from the central region into the polishing pad through the debris drain groove.
    公开号:FR3034032A1
    申请号:FR1652618
    申请日:2016-03-25
    公开日:2016-09-30
    发明作者:Bainian Qian；Ethan Scott Simon；George C Jacob
    申请人:Rohm and Haas Electronic Materials CMP Holdings Inc；Dow Global Technologies LLC；
    IPC主号:
    专利说明:

    [0001] BACKGROUND [0001] The present invention relates to polishing buffer windows useful for tracking the polishing rate and detecting the end of polishing operation. In particular, it relates to a window configuration useful for limiting polishing defects or useful for reducing variations in signal transmission. [0002] Polyurethane buffers are the main type of buffers for various demanding precision polishing applications. For example, polyurethane buffers have high mechanical strength to resist tearing, high abrasion resistance to avoid wear problems during polishing, and high stability to resist attack by polishing solutions strongly acidic and strongly caustic. These polyurethane buffers are effective for polishing multiple substrates, including: silicon wafers, gallium arsenide wafers, and other III-V SiC semiconductors, patterned wafers , flat panel displays, glass, such as sapphire, and magnetic storage discs. In particular, polyurethane buffers provide the mechanical integrity and chemical resistance for most polishing operations used to fabricate integrated circuits. Unfortunately, these polyurethane buffers tend to have insufficient transparency for laser or optical detection of the end of operation during polishing. [0003] Since the mid-1990s, optical tracking systems with end-of-operation detection have been used to determine the polishing time with a laser or optical determination of the end of operation for semi-automatic applications. conductors. These optical tracking systems allow the detection of the end of in situ polishing operation of a wafer substrate during polishing with a light source and a light detector. The light source directs a light beam that passes through a transparent window towards the substrate that is being polished. The light detector measures the light reflected by the wafer-like substrate which again passes through the transparent window in the other direction. An optical path is formed from the light source, which passes through the transparent window and reaches the substrate which is being polished, the reflected light again passing through the transparent window in the other direction to arrive at the light detector. [0004] Typically, the transparent window is in the same plane as the polishing surface of the polishing pads. However, other configurations include a recess between the window and the surface of the slab. During polishing, this recess fills with suspension. If the recess is too deep, the suspension and polishing debris can block or diffract the optical path so that the signal strength may be insufficient to achieve reliable detection of the end of the polishing operation. . The polishing debris accumulated on the surface of a recessed window can scratch the wafer substrate and create defects in the resulting semiconductor. [0005] There remains a need for a window having improved optical signal strength combined with a lower risk of creating polishing defects in the wafer. SUMMARY OF THE INVENTION [0006] One aspect of the invention provides a polishing pad suitable for polishing or planarizing at least one of semiconductor substrates, optical substrates and magnetic substrates, the polishing pad having a polishing surface, an aperture through the polishing pad, a radius extending from the center of the polishing pad to the perimeter of the polishing pad, and a transparent window in the aperture in the polishing pad; The transparent window being attached to the polishing pad and being transparent to at least one of the magnetic signals and the optical signals, the transparent window having a concave surface with respect to the polishing surface, the concave surface having a maximum depth in a central region of the transparent window, as measured from the plane of the polishing surface, which increases with the use of the polishing pad; a signal region in the transparent window adjacent to the central region and the nearest side of the center of the polishing pad for transmitting at least one of optical signals and magnetic signals to a wafer, the signal region being inclined down towards the central region to facilitate removal of debris, and a debris discharge groove which extends through the central region in the polishing pad, so that rotation of the polishing pad with polishing fluid in the debris discharge groove feeds the debris from the central region into the polishing pad through the debris drain groove and wherein the depth of the debris drain groove is more great as the depth of the central region. [0007] Another aspect of the invention provides a polishing pad suitable for polishing or planarizing at least one of the semiconductor substrates, the optical substrates and the magnetic substrates, the polishing pad containing microspheres filled with fluid. and having a polishing surface, an opening through the polishing pad, a radius extending from the center of the polishing pad 25 to the perimeter of the polishing pad and a transparent window in the opening in the polishing pad. polishing, the transparent window being fixed to the polishing pad with a lateral spacing smaller than the average diameter of the microspheres filled with fluid and being transparent to at least one of the magnetic signals and the optical signals, the transparent window having a concave surface by 3034032 4 relative to the polishing surface, the concave surface having a maximum depth in a central region of the transparent window, as measured from the plane of the polishing surface, which increases with the use of the polishing pad; a signal region in the transparent window adjacent to the central region and the nearest side of the center of the polishing pad for transmitting at least one of optical signals and magnetic signals to a wafer, the signal region being inclined down towards the central region to facilitate removal of debris, and a debris drain groove which extends through the central region into the polishing pad, so that the rotation of the polishing pad with polishing fluid in the debris discharge groove feeds debris from the central region into the polishing pad through the debris drain groove and wherein the depth of the debris drain groove is greater than the depth of the central region. DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic representation of a drained window of the invention having a circumferential groove, i.e. parallel to the circumference, contiguous to a circumferential groove of the polishing pad. FIG. 1A is an enlarged schematic representation of a drained window of FIG. 1. FIG. 1B is a radial cross-section of the drained window of FIG. 1 having a circumferential groove contiguous to a circumferential groove. polishing pad before polishing. FIG. 1C is a radial cross-section of a drained window of FIG. 1 having a circumferential groove contiguous to a circumferential groove of the polishing pad after polishing multiple slabs. FIG. 2 is a schematic representation of a drained window of the invention having a radial groove contiguous to a radial groove of the polishing pad. FIG. 2A is an enlarged schematic representation of a drained window of FIG. 2. FIG. 2B is a radial cross section of the drained window of FIG. 2 having a radial groove contiguous to a radial groove. polishing pad before polishing. [0015] FIG. 2C is a radial cross-section of a drained window of FIG. 2 having a radial groove contiguous to a radial groove of the polishing pad after polishing multiple slabs. FIG. 3 is a schematic representation of a drained window of the invention having a circumferential groove and a radial groove respectively contiguous with a circumferential groove and a radial groove of the polishing pad. FIG. 3A is an enlarged schematic representation of a drained window of FIG. 3. FIG. 3B is a radial cross-section of the drained window of FIG. 3 having a circumferential groove and a contiguous radial groove. a circumferential groove and a radial groove of the polishing pad before polishing. FIG. 3C is a radial cross section of a drained window of FIG. 3 having a circumferential groove and a radial groove contiguous to a circumferential groove and a radial groove of the polishing pad after polishing multiple slabs. DETAILED DESCRIPTION OF THE INVENTION [0020] The polishing pad of the invention is suitable for polishing or planarizing at least one of semiconductor substrates, optical substrates and magnetic substrates. Preferably, the buffer polishes or planarizes a semiconductor substrate. The polishing pad may be a porous or non-porous substrate. Examples of porous substrates include expanded buffers, extruded buffers containing a dissolved gas, and matrices in which hollow polymeric microspheres are included. A transparent window 5 which is transparent to at least one of the magnetic signals and the optical signals is attached to the polishing pad. Preferably, the window is transparent to the optical signals. More preferably, the window is an optically transparent polymer. Unloaded polyurethane materials can have an excellent combination of transparency, polishability and low defect for polishing semiconductor substrates. Typically, these polyurethanes represent a mixture of aliphatic polyurethanes for transparency and aromatic polyurethanes for mechanical strength. Preferably, the polishing pad is porous, the transparent window is nonporous and the molding of the polishing pad around the transparent window affixes the transparent window to the polishing pad. [0021] In CMP buffers formed without adequate cushion between the window and the polishing pad, a shallow cavity is formed when the window becomes more concave. The transparent window forms a concave surface with respect to the polishing surface during manufacture or polishing. The concave surface has a maximum depth in a central region of the transparent window, as measured from the plane of the polishing surface, which increases with the use of the polishing pad. A small gap or absence of spacing between the window and the polishing pad can increase the depth of the concave transparent window. In addition, polymeric microspheres filled with fluid in the polishing pad can further increase the depth of the concave transparent window. For example, compression of gas-filled microspheres, liquid or a gas-liquid mixture can concentrate the forces applied against the window. This shallow cavity can be filled with suspension and polishing debris that attenuate the intensity of the signal passing through the window. As the window becomes more concave, cavity 5 becomes deeper and additional suspension and polishing debris tends to accumulate, further reducing the signal strength. In the polishing pad of the invention, the signal region is inclined downward towards the central region to facilitate removal of the slurry and polishing debris and a debris evacuation groove extends to through the central region in the polishing pad. Rotation of the polishing pad with polishing fluid in the debris discharge groove feeds the polishing debris from the central region of the transparent window into the groove of the polishing pad. Although all of the figures represent a rectangular shaped window, the window may also have a round, square, oval or other shape. Referring to Figures 1 and 1A, the polishing pad 10 having circular grooves 12 can polish or planarize semiconductor substrates, optical or magnetic (not shown). The polishing pad typically includes a porous polyurethane matrix, but the matrix may be formed of other polymers. Optionally, the polymeric matrix of the polishing pad 10 includes microspheres filled with fluid (not shown). Alternatively, the grooves may be combined with spiral, low flow grooves, XY grooves, concentric hexagon grooves, concentric dodecagone grooves, hexadecagon grooves concentric, polygonal grooves or grooves having other known shapes. The polishing pad 10 has a polishing surface 16 that interacts with the semiconductor substrate, optical or magnetic. An opening 18 through the polishing pad 10 provides a location for securing a transparent window 20. When the polymeric matrix of the polishing pad 10 includes microspheres filled with fluid, the polishing pad and the window are preferably attached to each other with a lateral spacing smaller than the average diameter of the microspheres filled with fluid. For example, molding the window in the pad provides a direct connection between the transparent window 20 and the polishing pad 10 substantially without gaps between the transparent window 20 and the polishing pad 10. A radius R1 extends from the center 22 to the perimeter 24 of the polishing pad 10. Referring to FIG. 1A, a circular groove 12 extends into the bow-shaped debris discharge groove 12A to facilitate debris removal. The arc-shaped debris discharge groove 12A extends across the entire width of the transparent window 20. [0023] Referring to FIGS. 1B and 1C, the window 20 of the polishing pad 10 may have a flat surface 30 parallel to the polishing surface 16 or a concave surface 32 as measured with respect to the polishing surface 16. A sub-pad 34 supports the polishing pad 10 and the outer perimeter of the window 20. During polishing, the window 20 deforms and becomes concave. Typically, window 20 becomes increasingly concave as polishing progresses. Optionally, the pad 10 may comprise a concave surface 32 from the beginning of polishing. The concave surface 32 has a maximum depth D1 in a central region 36 of the transparent window 20 as measured from the plane of the polishing surface 16. During polishing the window 20 is deformed which increases the value of D1. A signal region 38 in the transparent window 20 is adjacent to the central region 36 and is disposed on the side closest to the center 22 (Fig. 1) of the polishing pad 10. The signal region 38 transmits at least one signal among Optical signals and magnetic signals to a wafer 40 held by the wafer support 42. The signal region 38 is inclined downwardly toward the central region 36 to facilitate debris removal. The bow-shaped debris discharge groove 12A extends through the central region 36 into the polishing pad 10 so that the rotation of the polishing pad 10 with polishing fluid in the evacuation groove arc-shaped debris 12A sends the debris from the central region 36 into the polishing pad 10 through the arc-shaped debris discharge groove 12A. The depth of the bow-shaped debris discharge groove 12A is greater than the depth D1 of the central region 36 as measured from the plane of the polishing surface 16. [0024] During the polishing, the end of operation detector 50 sends the signal 52 through the signal region 38 of the transparent window 20 so that the signal strikes the wafer 40. The signal 52 then crosses again the signal region 38 and the end of operation detector 50 determines whether to continue or stop the polishing of the wafer 40. [0025] Referring to FIGS. 2 and 2A, the polishing pad 110 having radial grooves 114 may polish or planarize Semiconductor substrates, optical or magnetic (not shown). The polishing pad typically includes a porous polyurethane matrix, but the matrix may be formed of other polymers. Optionally, the polymeric matrix of the polishing pad 110 includes fluid filled microspheres (not shown). Alternatively, the grooves 25 may be combined with concentric circular grooves, low flow spiral grooves, XY grooves, concentric dodecagon grooves, concentric hexagon grooves, grooves in the form of concentric hexadecagons, polygonal grooves or grooves having other known shapes. The polishing pad 110 has a polishing surface 116 that interacts with the semiconductor, optical or magnetic substrate. An aperture 118 through the polishing pad 110 provides a location for securing a transparent window 120. When the polymeric matrix of the polishing pad 110 includes fluid filled microspheres, the polishing pad and the window are preferably affixed thereto. to one another with a lateral spacing smaller than the average diameter of the fluid-filled microspheres. For example, molding the window in the pad provides a direct connection between the transparent window 120 and the polishing pad 110 with substantially no gap between the transparent window 120 and the polishing pad 110. A radius R2 extends from the center 122 to the perimeter 124 of the polishing pad 110. Referring to Fig. 2A, a radial groove 114 extends from the radial debris discharge groove 114A to facilitate debris removal. The length of the radial debris discharge groove 114A extends for about half the length of the transparent window 120. [0026] Referring to FIGS. 2B and 2C, the window 120 of the polishing pad 110 can have a flat surface 130 parallel to the polishing surface 116 or a concave surface 132 as measured with respect to the polishing surface 116. A sub-pad 134 supports the polishing pad 110 and the outer perimeter of the polishing pad 116. window 120. During polishing, the window 120 is deformed and becomes concave. Typically, window 120 becomes increasingly concave as polishing progresses. Optionally, the buffer 110 may comprise a concave surface 132 from the beginning of polishing. The concave surface 132 has a maximum depth D2 in a central region 136 of the transparent window 120 as measured from the plane of the polishing surface 116. During polishing the window 120 is deformed which increases the value of D2. A signal region 138 in the transparent window 120 is adjacent to the central region 136 and is disposed on the side closest to the center 122 (Fig. 2) of the polishing pad 110. The signal region 138 transmits at least one signal from optical signals and magnetic signals to a wafer 140 held by the wafer carrier 142. The signal region 138 is inclined downwardly toward the central region 136 to facilitate debris removal. The debris evacuation groove 114A extends through the central region 136 into the polishing pad 110 so that the rotation of the polishing pad 110 with polishing fluid in the radial debris evacuation groove 114A sends the debris from the central region 136 into the polishing pad 110 through the radial debris evacuation groove 114A. The depth of the radial debris discharge groove 114A is greater than the depth D2 of the central region 136 as measured from the plane of the polishing surface 116. During the polishing the end detector 150 sends the signal 152 through the signal region 138 of the transparent window 120 so that the signal strikes the wafer 140. The signal 152 then crosses again the signal region 138 and the end detector. Operation 150 determines whether to continue or discontinue polishing of wafer 140. [0028] Referring to FIGS. 3 and 3A, polishing pad 210 having concentric circular grooves 212 and radial grooves 214 may be polished or planarized. semiconductor, optical or magnetic substrates (not shown). The polishing pad typically includes a porous polyurethane matrix, but the matrix may be formed of other polymers. Optionally, the polymeric matrix of the polishing pad 210 includes microspheres filled with fluid (not shown). Alternatively, the grooves may be combined with concentric circular grooves, spiral, low-flow grooves, XY grooves, concentric hex-shaped grooves, concentric dodecagon grooves, grooves in the form of concentric hexadecagons, polygonal grooves or grooves having other known shapes. The polishing pad 210 has a polishing surface 216 that interacts with the semiconductor substrate, optical or magnetic. An aperture 218 through the polishing pad 210 provides a location for securing a transparent window 220. When the polymeric matrix of the polishing pad 210 includes microspheres filled with fluid, the polishing pad and the window are preferably affixed thereto. to one another with a lateral spacing smaller than the average diameter of the fluid-filled microspheres. For example, molding the window in the buffer provides a direct connection between the transparent window 220 and the polishing pad 210 with substantially no gap between the transparent window 220 and the polishing pad 210. A radius R3 extends from the center 222 to the perimeter 224 of the polishing pad 210. Referring to FIG. 3A, a circular groove 212 extends into the arc-shaped debris discharge groove 212A to facilitate debris removal. The arc-shaped debris discharge groove 212A extends the full width of the transparent window 220 and communicates with the radial debris discharge groove 214A to allow debris to flow between the channels. removal of debris. A radial groove 214 extends from the radial debris discharge groove 214A to facilitate removal of debris. The length of the radial debris discharge groove 214A extends for about half the length of the transparent window 220. [0029] Referring to FIGS. 3B and 3C, the window 220 of the polishing pad 210 can have a flat surface 230 parallel to the polishing surface 216 or a concave surface 232 as measured with respect to the polishing surface 216. A sub-pad 234 supports the polishing pad 210 and the outer perimeter of the window 220. During polishing, the window 220 is deformed and becomes concave.
    [0002] Typically, window 220 becomes increasingly concave as polishing progresses. Optionally, the pad 210 may comprise a concave surface 232 from the beginning of the polishing. The concave surface 232 has a maximum depth D3 in a central region 236 of the transparent window 220 as measured from the plane of the polishing surface 216. During polishing the window 220 is deformed which increases the value of D3. A signal region 238 in the transparent window 220 is adjacent to the central region 236 and is disposed on the side closest to the center 222 (Fig. 3) of the polishing pad 210. The signal region 238 transmits at least one of optical signals and magnetic signals to a wafer 240 held by the wafer carrier 242. The signal region 238 is inclined downwardly toward the central region 236 to facilitate debris removal. The debris discharge grooves 212A and 214A extend through the central region 236 into the polishing pad 210 so that the polishing pad 210 rotates with polishing fluid in the debris discharge grooves 212A. and 214A sends the debris from the central region 236 into the polishing pad 210 through the debris evacuation grooves 212A and 214A. The depths of the debris discharge grooves 212A and 214A are larger than the depth D3 of the central region 236 as measured from the plane of the polishing surface 216. [0030] During polishing, the detector of End of operation 250 sends the signal 252 through the signal region 238 of the transparent window 220 so that the signal strikes the wafer 240. The signal 252 then crosses again the signal region 238 and the end detector. Operation 250 determines whether to continue or discontinue polishing of the wafer 240. [0031] The above examples include circular grooves, radial grooves, and combined circular and radial grooves. These examples operate by aligning the debris discharge groove with the grooves of the polishing pad. This concept also works with grooves having other shapes, such as spiral, low flow grooves, XY grooves, concentric hex-shaped grooves, concentric dodecagon grooves, grooves in the form of concentric hexagons. concentric hexadecagons, polygonal grooves or grooves having other known shapes or combinations of these forms. In these groove configurations, the debris drain grooves align with the grooves of the polishing pad for effective removal of debris. The window of the invention provides a channel constituted by a groove that functions to remove debris for concave polishing pad windows. Because the groove weakens the window structure and promotes bending, it is contraindicated to weaken the window structure. The window design of the invention removes debris while maintaining transparency for effective signal strength and endpoint detection.
    权利要求:
    Claims (10)
    [0001]
    REVENDICATIONS1. Polishing pad (10; 110; 210) suitable for polishing or planarizing at least one of the semiconductor substrates, the optical substrates and the magnetic substrates, the polishing pad (10; 110; 210) has a polishing surface (16; 116; 216), an aperture (18; 118; 218) through the polishing pad, a radius (R1; R2; R3) extending from the center (22; 122; 222) of the polishing pad; polishing to the perimeter (24; 124; 224) of the polishing pad and a transparent window (20; 120; 220) in the opening (18; 118; 218) in the polishing pad; the transparent window (20; 120; 220) being fixed to the polishing pad and being transparent to at least one of the magnetic signals and the optical signals, the transparent window having a concave surface (32; 132; 232) with respect to the polishing surface (16; 116, 216), the concave surface having a maximum depth (D1; D2; D3) in a central region (36; 136; 236) of the transparent window as measured from the plane of the polishing surface which increases with the use of the polishing pad; a signal region (38; 138; 238) in the transparent window adjacent to the central region (36; 136; 236) and disposed on the nearest side of the center (22; 122; 222) of the polishing pad to transmit to the least one of optical signals and one-wafer magnetic signals (40; 140; 240), the signal region (38; 138; 238) being inclined downwardly toward the central region (36; 136; 236); ) to facilitate debris removal, and a debris discharge groove (12A; 114A; 212A, 214A) which extends through the central region in the polishing pad, so that rotation of the polishing pad with polishing fluid in the debris discharge groove feeds the debris from the central region into the polishing pad through the debris discharge groove and wherein the depth of the debris discharge groove (12A; 114A; 212A, 214A) is larger than the depth (D1; D2; D3) of the central region (36; 136; 236). 5
    [0002]
    The polishing pad (110; 210) according to claim 1, wherein the debris discharge groove (114A; 214A) extends along the radius (R2; R3) extending from the center (122; 222 ) from the polishing pad to the perimeter (124; 224) of the polishing pad. 10
    [0003]
    The polishing pad (10; 210) of claim 1, wherein the debris discharge groove (12A; 212A) extends parallel to the circumference of the polishing pad.
    [0004]
    The polishing pad (10; 110; 210) according to any one of claims 1 to 3, wherein the window (20; 120; 220) is an optically transparent polymer.
    [0005]
    The polishing pad (10; 110; 210) according to any one of claims 1 to 4, wherein the polishing pad is porous, the transparent window is non-porous and the polishing pad is molded around the transparent window so as to fix the transparent window to the polishing pad.
    [0006]
    A polishing pad (10; 110; 210) suitable for polishing or planarizing at least one of the semiconductor substrates, the optical substrates and the magnetic substrates, the polishing pad (10; 110; 210) containing microspheres filled with fluid and has a polishing surface (16; 116; 216), an opening (18; 118; 218) through the polishing pad, a radius (R1; R2; R3) extending from the center 30 (22; 122; 222) of the polishing pad to the perimeter (24; 124; 3034032 17,224) of the polishing pad and a transparent window (20; 120; 220) in the opening (18; 118; 218); ) in the polishing pad, the transparent window (20; 120; 220) being fixed to the polishing pad with a lateral spacing smaller than the average diameter of the fluid-filled microspheres and being transparent to at least one of the signals magnetic and optical signals, the transparent window (20; 120; 220) having concave surface (32; 132; 232) relative to the polishing surface (16; 116; 216), the concave surface having a maximum depth (D1; D2; D3) in a central region (36; 136; 236) of the transparent window, such as it is measured from the plane of the polishing surface, which increases with the use of the polishing pad; a signal region (38; 138; 238) in the transparent window adjacent to the central region (36; 136; 236) and disposed on the nearest side of the center (22; 122; 222) of the polishing pad 15 for transmitting at least one of optical signals and one-wafer magnetic signals (40; 140; 240), the signal region (38; 138; 238) being downwardly inclined toward the central region (36; 136; 236) to facilitate debris removal, and a debris discharge groove (12A; 114A; 212A, 214A) extending through the central region in the polishing pad, such that the rotation of the buffer polishing with polishing fluid in the debris discharge groove sends the debris from the central region into the polishing pad through the debris discharge groove and into which the depth of the debris drain groove (12A; 114A; 212A, 214A) is larger than at depth (D1; D2; D3) of the central region (36; 136; 236).
    [0007]
    The polishing pad (110; 210) according to claim 6, wherein the debris discharge groove (114A; 214A) extends along the radius (R3; R3) extending from the center (122). 222) of the polishing pad to the perimeter (124; 224) of the polishing pad.
    [0008]
    The polishing pad (10; 210) of claim 6, wherein the debris discharge groove (12A; 212A) extends parallel to the circumference of the polishing pad.
    [0009]
    Polishing pad (10; 110; 210) according to any one of claims 6 to 8, wherein the window (20; 120; 220) is an optically transparent polymer.
    [0010]
    The polishing pad (10; 110; 210) according to any one of claims 6 to 9, wherein the polishing pad is porous, the transparent window is non-porous and the polishing pad is molded around the transparent window so as to fix the transparent window to the polishing pad.
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    同族专利:
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    法律状态:
    2017-02-13| PLFP| Fee payment|Year of fee payment: 2 |
    2018-02-23| PLFP| Fee payment|Year of fee payment: 3 |
    2018-07-06| PLSC| Search report ready|Effective date: 20180706 |
    2019-08-23| RX| Complete rejection|
    优先权:
    申请号 | 申请日 | 专利标题
    US14/669,421|US9475168B2|2015-03-26|2015-03-26|Polishing pad window|
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